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May 20, 2025 05:01 ET | Source: Deca Technologies

Deca annuncia un accordo con IBM per portare la produzione di interposer fan-out ad alta densità in Nord America

TEMPE, Arizona, May 20, 2025 (GLOBE NEWSWIRE) -- Deca Technologies ha annunciato oggi la firma di un accordo con IBM per l'implementazione delle tecnologie M-Series™ e Adaptive Patterning® di Deca...
May 20, 2025 05:01 ET | Source: Deca Technologies

Deca gibt Vereinbarung mit IBM bekannt, um die Produktion von hochdichten Fan-Out-Interposern nach Nordamerika zu bringen

TEMPE, Arizona, May 20, 2025 (GLOBE NEWSWIRE) -- Deca Technologies gab heute die Unterzeichnung einer Vereinbarung mit IBM zur Implementierung der M-Series™- und Adaptive-Patterning®-Technologien...
May 20, 2025 05:01 ET | Source: Deca Technologies

Deca Announces Agreement with IBM to Bring High-Density Fan-Out Interposer Production to North America

Deca and IBM partner to bring high-volume fan-out interposer tech to North America, advancing AI and HPC chiplet packaging at IBM’s Bromont site.