Latest News and Press Releases

TEMPE, Arizona, May 20, 2025 (GLOBE NEWSWIRE) -- Deca Technologies ha annunciato oggi la firma di un accordo con IBM per l'implementazione delle tecnologie M-Series™ e Adaptive Patterning® di Deca...

TEMPE, Arizona, May 20, 2025 (GLOBE NEWSWIRE) -- Deca Technologies gab heute die Unterzeichnung einer Vereinbarung mit IBM zur Implementierung der M-Series™- und Adaptive-Patterning®-Technologien...

Deca and IBM partner to bring high-volume fan-out interposer tech to North America, advancing AI and HPC chiplet packaging at IBM’s Bromont site.

Deca Technologies and ASU today announced a collaboration to create North America’s first fan-out wafer-level packaging research and development center.

TEMPE, Ariz., Oct. 18, 2022 (GLOBE NEWSWIRE) -- Deca Technologies, a leading provider of advanced electronic interconnect technology, is proud to announce that its founder and CEO, Tim Olson, was...

TEMPE, Ariz., March 18, 2021 (GLOBE NEWSWIRE) -- Deca, an industry-leading pure-play technology provider for advanced semiconductor packaging, announced the introduction of its new APDK™ (Adaptive...

TEMPE, Ariz., Oct. 20, 2020 (GLOBE NEWSWIRE) -- Deca, an industry-leading provider of advanced electronic interconnect technologies, announced today the signing of an agreement with ADTEC...

TEMPE, Ariz., Oct. 01, 2019 (GLOBE NEWSWIRE) -- Deca Technologies is pleased to announce that it has reached an agreement with nepes Corporation (nepes) whereby nepes will expand its geographic...

TEMPE, Ariz., Aug. 14, 2019 (GLOBE NEWSWIRE) -- Deca Technologies, a wafer-level electronic interconnect solutions provider to the semiconductor industry, today announced that Industry researchers...