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Deca Technologies and ASU today announced a collaboration to create North America’s first fan-out wafer-level packaging research and development center.
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TEMPE, Ariz., Oct. 18, 2022 (GLOBE NEWSWIRE) -- Deca Technologies, a leading provider of advanced electronic interconnect technology, is proud to announce that its founder and CEO, Tim Olson, was...
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TEMPE, Ariz., March 18, 2021 (GLOBE NEWSWIRE) -- Deca, an industry-leading pure-play technology provider for advanced semiconductor packaging, announced the introduction of its new APDK™ (Adaptive...
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TEMPE, Ariz., Oct. 20, 2020 (GLOBE NEWSWIRE) -- Deca, an industry-leading provider of advanced electronic interconnect technologies, announced today the signing of an agreement with ADTEC...
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TEMPE, Ariz., Oct. 01, 2019 (GLOBE NEWSWIRE) -- Deca Technologies is pleased to announce that it has reached an agreement with nepes Corporation (nepes) whereby nepes will expand its geographic...
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TEMPE, Ariz., Aug. 14, 2019 (GLOBE NEWSWIRE) -- Deca Technologies, a wafer-level electronic interconnect solutions provider to the semiconductor industry, today announced that Industry researchers...