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May 20, 2025 05:01 ET | Source: Deca Technologies

Deca annuncia un accordo con IBM per portare la produzione di interposer fan-out ad alta densità in Nord America

TEMPE, Arizona, May 20, 2025 (GLOBE NEWSWIRE) -- Deca Technologies ha annunciato oggi la firma di un accordo con IBM per l'implementazione delle tecnologie M-Series™ e Adaptive Patterning® di Deca...
May 20, 2025 05:01 ET | Source: Deca Technologies

Deca gibt Vereinbarung mit IBM bekannt, um die Produktion von hochdichten Fan-Out-Interposern nach Nordamerika zu bringen

TEMPE, Arizona, May 20, 2025 (GLOBE NEWSWIRE) -- Deca Technologies gab heute die Unterzeichnung einer Vereinbarung mit IBM zur Implementierung der M-Series™- und Adaptive-Patterning®-Technologien...
May 20, 2025 05:01 ET | Source: Deca Technologies

Deca Announces Agreement with IBM to Bring High-Density Fan-Out Interposer Production to North America

Deca and IBM partner to bring high-volume fan-out interposer tech to North America, advancing AI and HPC chiplet packaging at IBM’s Bromont site.
January 21, 2025 11:56 ET | Source: Transparency Market Research

Advanced Semiconductor Packaging Market to Generate US$ 40.3 Billion in Revenue by 2031, Driven by the Surge in Demand for Miniaturized Electronics | Latest Report by TMR

Wilmington, Delaware, Transparency Market Research Inc. –, Jan. 21, 2025 (GLOBE NEWSWIRE) -- The Advanced Semiconductor Packaging Market (반도체 패키징 시장), valued at US$ 30.1 Bn in 2022, is poised for...
March 19, 2024 08:02 ET | Source: Deca Technologies

Arizona State University and Deca Technologies to Pioneer North America’s First R&D Center for Advanced Fan-Out Wafer-Level Packaging

Deca Technologies and ASU today announced a collaboration to create North America’s first fan-out wafer-level packaging research and development center.
June 08, 2023 09:00 ET | Source: Persistence Market Research

Interposer and Fan-Out WLP Market Poised for Steady Growth and Projected to Reach US$ 103 Billion by 2032: Persistence Market Research

New York, June 08, 2023 (GLOBE NEWSWIRE) -- The global interposer and fan-out WLP market revenue totaled US$ 13.4 billion in 2022. From 2022 to 2033, global interposer and fan-out WLP demand is...