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TEMPE, Arizona, May 20, 2025 (GLOBE NEWSWIRE) -- Deca Technologies ha annunciato oggi la firma di un accordo con IBM per l'implementazione delle tecnologie M-Series™ e Adaptive Patterning® di Deca...
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TEMPE, Arizona, May 20, 2025 (GLOBE NEWSWIRE) -- Deca Technologies gab heute die Unterzeichnung einer Vereinbarung mit IBM zur Implementierung der M-Series™- und Adaptive-Patterning®-Technologien...
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Deca and IBM partner to bring high-volume fan-out interposer tech to North America, advancing AI and HPC chiplet packaging at IBM’s Bromont site.
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Deca Technologies and ASU today announced a collaboration to create North America’s first fan-out wafer-level packaging research and development center.
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TEMPE, Ariz., Oct. 18, 2022 (GLOBE NEWSWIRE) -- Deca Technologies, a leading provider of advanced electronic interconnect technology, is proud to announce that its founder and CEO, Tim Olson, was...
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TEMPE, Ariz., Oct. 01, 2019 (GLOBE NEWSWIRE) -- Deca Technologies is pleased to announce that it has reached an agreement with nepes Corporation (nepes) whereby nepes will expand its geographic...