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Deca Technologies and ASU today announced a collaboration to create North America’s first fan-out wafer-level packaging research and development center.
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TEMPE, Ariz., Oct. 18, 2022 (GLOBE NEWSWIRE) -- Deca Technologies, a leading provider of advanced electronic interconnect technology, is proud to announce that its founder and CEO, Tim Olson, was...
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TEMPE, Ariz., Oct. 01, 2019 (GLOBE NEWSWIRE) -- Deca Technologies is pleased to announce that it has reached an agreement with nepes Corporation (nepes) whereby nepes will expand its geographic...