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March 18, 2021 09:00 ET | Source: Deca Technologies

Deca collaborates with ASE and Siemens to launch APDK™ design methodology

TEMPE, Ariz., March 18, 2021 (GLOBE NEWSWIRE) -- Deca, an industry-leading pure-play technology provider for advanced semiconductor packaging, announced the introduction of its new APDK™ (Adaptive...
October 20, 2020 09:00 ET | Source: Deca Technologies

Deca Partners with ADTEC Engineering to Enhance Adaptive Patterning™ for 2µm Chiplet Scaling

TEMPE, Ariz., Oct. 20, 2020 (GLOBE NEWSWIRE) -- Deca, an industry-leading provider of advanced electronic interconnect technologies, announced today the signing of an agreement with ADTEC...
November 07, 2012 08:00 ET | Source: Deca Technologies

Deca Technologies Unveils M-Series(TM) CSP With Adaptive Patterning(TM)

TEMPE, AZ--(Marketwire - Nov 7, 2012) - Deca Technologies, an electronic interconnect solutions provider to the semiconductor industry, today announced the introduction of the new...