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March 04, 2025 07:02 ET | Source: Terecircuits

Terecircuits Becomes National Semiconductor Technology Center Member

Terecircuits joins NSTC, gaining access to resources, facilities, and partnerships to drive innovation in advanced packaging materials.
October 08, 2024 05:02 ET | Source: Terecircuits

Terecircuits Unveils New Bonding Material for Next-Generation Advanced Packaging

Terecircuits unveiled Terefilm®, a patented material designed for temporary bonding and debonding applications in semiconductor advanced packaging.