Latest News and Press Releases

QP Technologies has added new dicing and pick-and-place equipment to expand its wafer and die preparation business.

QP Technologies' Escondido, CA, facility has been certified ANSI/ESD S20.20-compliant, furthering the company's broad commitment to quality and safety.

QP Technologies has achieved ISO 9001:2015 and ISO 13485:2016 certifications from standards auditing and certification body TÜV SÜD America.

ESCONDIDO, Calif., March 16, 2023 (GLOBE NEWSWIRE) -- QP Technologies™, a leading provider of innovative microelectronic packaging and assembly solutions, today announced it has extended its broad...

BOSTON, Oct. 03, 2022 (GLOBE NEWSWIRE) -- QP Technologies™ (formerly Quik-Pak), a leading provider of innovative microelectronic packaging and assembly solutions, today announced it is expanding its...

ESCONDIDO, Calif., Sept. 29, 2021 (GLOBE NEWSWIRE) -- QP Technologies™ (formerly Quik-Pak), a leading provider of innovative microelectronic packaging and assembly solutions, has added multiple new...

ESCONDIDO, Calif., Aug. 16, 2021 (GLOBE NEWSWIRE) -- QP Technologies™ (formerly Quik-Pak), a leading provider of innovative microelectronic packaging and assembly solutions, today announced it has...

ESCONDIDO, Calif., March 29, 2021 (GLOBE NEWSWIRE) -- QP Technologies™ (formerly Quik-Pak), a leading provider of innovative microelectronic packaging and assembly solutions, today announced...

New brand reflects growing breadth of company’s technology and engineering capabilities ESCONDIDO, Calif., March 11, 2021 (GLOBE NEWSWIRE) -- Leading provider of microelectronic packaging and...

ESCONDIDO, Calif., Oct. 06, 2020 (GLOBE NEWSWIRE) -- Quik-Pak, together with Agile Microwave Technology (AgileMwT) and OMMIC SA, today announced its line of JEDEC-compliant air-cavity QFN packages....