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Axus Technology's Capstone CMP platform offers 2x higher throughput, more than 50% lower total cost per 200mm SiC wafer compared to leading competitor.
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Axus Technology is seeing orders from the top SiC makers around the world for its flexible, innovative Capstone CS200 CMP platform.
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Axus Technology has received $12.5 million in capital funding to advance high-volume production of its CMP systems used in semiconductor manufacturing.