Austin, July 30, 2025 (GLOBE NEWSWIRE) -- Semiconductor Plating System Market Size & Growth Insights:
According to the SNS Insider,“The Semiconductor Plating System Market size was valued at USD 5.58 billion in 2024 and is expected to reach USD 8.29 billion by 2032, growing at a CAGR of 5.12% over the forecast period of 2025-2032.”
Precision Demand, Advanced Packaging, and AI Drive Growth in Semiconductor Plating Systems
Semiconductor Plating System Market is gaining momentum owing to precision demand in power management components for EVs, miniaturized plating requirements in 5G and IoT, and sustainability objectives favoring green chemistries. Existing high-throughput plating tools are being used to meet this increased demand, along with expanding foundry capacities worldwide, particularly for MEMS, sensors, optoelectronics and power devices. Increasing demands of advanced interconnects and real-time defect control due to growth in data centers and cloud infrastructure is making packaging more complex. Some of the key trends include developments in electroplating for copper below 7 nm nodes, more research on hybrid substrates, in-country fabrication, and collaboration between industry and research. Electroplating is essential to the chiplet integration with logic ICs, mainly AI and HPC SoCs, accounting for 38% of advanced packaging in 2024.
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Leading Market Players with their Product Listed in this Report are:
- Lam Research
- Applied Materials
- Tokyo Electron
- SCREEN Holdings
- EBARA
- ASM International
- Kokusai Electric
- Semes
- SÜSS MicroTec
- Naura Technology
Semiconductor Plating System Market Report Scope:
| Report Attributes | Details |
| Market Size in 2024 | USD 5.58 Billion |
| Market Size by 2032 | USD 8.29 Billion |
| CAGR | CAGR of 5.12% From 2025 to 2032 |
| Report Scope & Coverage | Market Size, Segments Analysis, Competitive Landscape, Regional Analysis, DROC & SWOT Analysis, Forecast Outlook |
| Key Segmentation | • By Application (TSV, Copper Pillar, Redistribution Layer (RDL), Under Bump Metallization (UBM), Bumping, and Others) • By Technology (Electroplating, and Electroless) • By Wafer Size (Up to 100 mm, 100 mm - 200 mm, and Above 200 mm) |
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Key Industry Segmentation
By Application
Copper pillar technology dominated the semiconductor plating system market with 23.2% in 2024 due to its excellent electrical, thermal conductivity, and fine-pitch scalability, and its usage range for flip-chip and HDI packaging for high-performance processors.
By 2025 to 2032, Through-Silicon Via (TSV) technology is estimated to produce the fastest Corresponding Annual Growth (CAGR) because of its benefits in 3D IC packing, memory stacking, and heterogeneous combination. This is significant for the next several years as AI, 5G, and data-heavy applications will require shorter interconnects, less power and faster signal transmission via TSV.
By Technology
In 2024, electroplating dominated the global semiconductor plating system market with a 67.4% share, driven by its critical role in copper interconnects, RDL, and flip-chip bump formation.
Electroless plating is expected to register the fastest CAGR from 2025 to 2032, owing to its ability to uniformly coat complex 3D surfaces without external current. Its efficiency in UBM, barrier layers, and flexible electronics supports its growing use in advanced semiconductor packaging.
By Wafer Size
In 2024, the global semiconductor plating system market was led by the above 200 mm wafer segment, holding a 55.0% share, driven by the widespread use of 300 mm wafers in high-volume production of logic, memory, and HPC chips. Their high yield and scalability make them ideal for AI, 5G, and data center needs.
100–200 mm wafers are expected to grow fastest through 2032, fueled by demand in power electronics, MEMS, RF, and automotive applications.
Asia Pacific Leads Semiconductor Plating Growth; Global Regions Accelerate Capacity & Innovation
In 2024, Asia Pacific led the semiconductor plating system market with a 42.5% share and is projected to grow at the fastest CAGR of 5.51% through 2032, driven by dense foundry ecosystems, skilled labor, and growing demand for advanced packaging. China dominates the region with large-scale investments and EV-driven demand.
North America is expanding rapidly due to strong AI and HPC adoption, new fabs, and automation trends, with the U.S. at the forefront. Europe sees gradual growth, led by Germany’s automotive and industrial focus. Latin America and MEA remain emerging markets, supported by industrial digitalization and infrastructure investments that are gradually fueling semiconductor demand.
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Recent News:
- In Aug 2024, ACM Research has introduced the Ultra ECP ap-p tool for fan-out panel-level packaging (FOPLP), enabling sub-micron plating on large panels with enhanced uniformity, automation, and compatibility with Cu, Ni, SnAg, and gold processes.
UPS of Semiconductor Plating System Market
- Digitalization & Smart Manufacturing Integration: Real-time smart manufacturing integration enhances precision and minimizes downtime.
- Application-Driven Demand Shifts: Flexible plating systems cater to evolving high-performance semiconductor applications.
- Value Chain Disruption and Vendor Realignment: Streamlined vendor partnerships accelerate supply chain agility and time-to-market.
- Sustainability and Waste Minimization: Eco-friendly plating solutions reduce waste and environmental impact while maintaining efficiency.
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