Advanced IC Substrate Market 2025-2035 | Glass Core Substrates and Embedded Die Technologies Reshape Semiconductor Packaging

Dublin, May 15, 2025 (GLOBE NEWSWIRE) -- The "Global Advanced IC Substrate Market 2025-2035" report has been added to ResearchAndMarkets.com's offering.

The global advanced IC substrate market is undergoing a significant transformation, driven by the increasing complexity of semiconductor designs and the rise of artificial intelligence applications. IC substrates have become a critical component in the semiconductor manufacturing ecosystem, particularly as 3D packaging technologies continue to evolve.

Advanced IC substrates serve as the critical interface between semiconductor chips and printed circuit boards, providing electrical connections, mechanical support, and thermal management. The market encompasses several key technologies: organic core substrates, glass core substrates (GCS), substrate-like PCBs (SLP), and embedded die technologies. Each of these platforms addresses specific requirements across applications ranging from high-performance computing to mobile devices and automotive electronics.

The market is experiencing robust growth. This growth trajectory is primarily fueled by the increasing demands of AI accelerators, data center applications, and advanced mobile processors, all of which require increasingly sophisticated substrate solutions. IC substrates are advancing along four critical dimensions: increased height (layer count), larger sizes, greater precision, and improved flatness. Substrate dimensions, which measured approximately 75x60mm in 2020, are projected to reach 150x150mm by 2026 - representing a dramatic increase in area to accommodate larger, more complex chips. Simultaneously, layer counts are expected to increase from 20 to 28 layers by 2026, a 40% growth that reflects the increasing interconnect density requirements of next-generation semiconductors.

The technical requirements are becoming increasingly stringent across all substrate types. Glass core substrates are emerging as a potential solution for ultra-high-density applications, though they remain in early commercialization stages. Substrate-like PCB technology continues to penetrate the mobile and consumer segments, while embedded die technology finds growing applications in automotive and industrial markets. The global supply chain for advanced IC substrates remains concentrated in East Asia, with Japan, Taiwan, South Korea, and increasingly China hosting major manufacturing capabilities.

Investment in advanced IC substrate manufacturing capacity has accelerated significantly since 2022, with major expansions announced across Taiwan, Japan, South Korea, and China. These investments are being driven both by market growth projections and by supply chain resilience concerns, which have prompted geographic diversification of manufacturing capabilities. Looking forward, technological innovation will continue to reshape the market.

Key development areas include ultra-fine line/space formation, warpage control for larger substrates, new materials with improved electrical and thermal properties, and manufacturing processes capable of higher precision at larger panel sizes. The integration of glass core substrates for high-performance applications and the evolution of embedded die technologies will further expand the capabilities of advanced IC substrates.

The Global Advanced IC Substrate Market 2025-2035 report provides an in-depth analysis of the rapidly evolving advanced IC substrate industry from 2025 to 2035. As semiconductor packaging becomes increasingly critical to system performance, advanced IC substrates have emerged as a cornerstone technology enabling next-generation computing, AI acceleration, automotive electronics, and mobile devices.

The report examines the transition from traditional organic substrates to emerging glass core substrates and embedded die technologies, analyzing how these platforms will reshape semiconductor packaging capabilities.

Report contents include:

• Complete Market Sizing and Forecasting: Detailed revenue projections, production volumes, and compound annual growth rates across all substrate technologies from 2025-2035
• Technology Evolution Roadmaps: Comprehensive analysis of organic, glass core, substrate-like PCB, and embedded die technology developments with clear migration paths
• Application-Specific Requirements: Detailed specifications for AI accelerators, data center, automotive, mobile, and consumer electronics applications
• Manufacturing Process Innovation: Analysis of advanced process technologies including amSAP, TGV formation, and ultra-fine line/space fabrication
• Supply Chain Mapping: Complete ecosystem analysis covering raw materials, equipment, manufacturing capabilities, and regional strengths/vulnerabilities
• Competitive Landscape: Detailed profiles of 115+ companies across the substrate manufacturing, materials, equipment, and semiconductor design ecosystem
• Sustainability Analysis: Environmental impact assessment, carbon footprint comparison, and ESG roadmaps for the substrate industry

This definitive industry report provides detailed profiles of 115+ companies across the advanced IC substrate ecosystem, including:

• 3DGSinc
• Aavco
• Absolics
• ACE-Pillar
• Achilles
• AGC
• AKC
• Ajinomoto
• AMD
• Anano
• AP-Solution
• Applied Materials
• ASE
• AT&S Austria Technologie & Systemtechnik
• BOE
• CGP Materials
• CHD Tech
• Chemtronics
• Ckplas
• Coherent
• Corning
• Covinc
• DMS
• DNP
• Dupont
• E&R
• Evatec
• Extolchem
• F&S Tech
• Fujikura
• Fujitsu
• GigaPhoton
• Gpline
• Google
• Guihua
• Hanbit-Laser
• HB Technology
• Hoemyeong-Industry
• Ibiden
• Infineon
• Innometry
• Intel
• JoongWoo
• JTNC
• Jusung-Engineering
• KCC-Glass
• KLA
• Kinsus
• Koto
• Lam Research
• Lante
• LG Innotek
• Lincotec
• LPKF
• LTC
• Mactech
• Man
• MediaTek
• Micro-technology
• Mirae
• Mitsui
• Mosaic Microsystems
• Murata
• Nan Ya PCB
• Nanya
• Neontech
• NEG
• NVIDIA
• NSG-Group
• Onto Innovation
• Pengcheng
• Philoptics
• PlanOptik
• Qorvo
• Qualcomm
• Rena
• Samsung Electro-Mechanics

and more.....

The report covers:

• Technical evolution of line/space capabilities, via sizes, form factors, and layer counts
• Glass core substrate emergence and commercialization timeline
• Substrate-like PCB expansion beyond mobile into automotive and IoT
• Embedded die technology integration strategies for active and passive components
• Co-packaged optics substrate requirements and implementation approaches
• Next-generation manufacturing technologies including AI-assisted design and additive fabrication
• Regional manufacturing capability development and reshoring initiatives
• Supply chain vulnerabilities, mitigation strategies, and diversification approaches
• Long-term sustainability considerations including water usage, carbon footprint, and circular economy strategies

Key Topics Covered:

1 EXECUTIVE SUMMARY
1.1 Market Overview and Key Findings
1.2 Critical Market Dynamics 2025-2035
1.3 Investment Landscape
1.4 Regional Growth Patterns
1.5 Technology Inflection Points
1.6 Competitive Landscape Evolution

2 INTRODUCTION TO ADVANCED IC SUBSTRATES
2.1 Evolution of Advanced IC Substrates (2015-2025)
2.2 Substrate Classification and Taxonomy
2.3 Key Technical Parameters and Performance Metrics
2.4 Role in Semiconductor Value Chain
2.5 The Race to Glass Substrates
2.6 Impact of Moore's Law Deceleration on Substrate Technology
2.7 Integration with Advanced Packaging Architectures

3 ADVANCED IC SUBSTRATE MARKET OVERVIEW
3.1 Market Size and Growth Trajectory (2025-2035)
3.2 Market Segmentation by Substrate Type
3.3 Market Segmentation by Application
3.4 Regional Market Analysis
3.5 Value Chain Analysis and Margin Distribution
3.6 Primary Market Drivers
3.6.1 AI and High-Performance Computing Demands
3.6.2 Data Center Evolution and Power Density Requirements
3.6.3 Automotive Electrification and Autonomy
3.6.4 Heterogeneous Integration and Chiplet Architecture
3.6.5 5G/6G Infrastructure Deployment
3.7 Key Market Restraints
3.7.1 Material and Manufacturing Limitations
3.7.2 Cost Constraints and Economies of Scale
3.7.3 Design Complexity and Time-to-Market Challenges
3.7.4 Supply Chain Vulnerabilities
3.8 Impact of Macroeconomic Factors
3.8.1 Global Semiconductor Cycles
3.8.2 Regional Investment Policies
3.8.3 Tariffs
3.8.4 Sustainability Regulations

4 TECHNOLOGIES
4.1 ORGANIC CORE SUBSTRATE TECHNOLOGY
4.1.1 Current State of Organic Substrate Technology
4.1.2 Materials Evolution
4.1.3 Manufacturing Process Innovations
4.1.4 Technical Challenges and Solutions
4.1.5 Technology Roadmap (2025-2035)
4.1.6 Case Studies: Next-Generation Organic Substrates
4.2 GLASS CORE SUBSTRATE TECHNOLOGY
4.2.1 Introduction to Glass Core Substrate Technology
4.2.2 Glass Material Properties and Selection Criteria
4.2.3 Glass Core Substrate Manufacturing Technologies
4.2.4 Technical Challenges and Solutions
4.2.5 Hybrid Glass-Organic Substrates
4.2.6 Technology Roadmap (2025-2035)
4.2.7 Case Studies: Pioneering Glass Core Applications
4.3 SUBSTRATE-LIKE PCB (SLP) TECHNOLOGY
4.3.1 SLP Technology Overview and Positioning
4.3.2 Materials and Design Considerations
4.3.3 Manufacturing Processes and Equipment
4.3.4 Application-Specific SLP Variants
4.3.5 Cost Structure and Manufacturing Economics
4.3.6 Technology Roadmap (2025-2035)
4.3.7 Case Studies: High-Volume SLP Applications
4.4 EMBEDDED DIE TECHNOLOGY
4.4.1 Embedded Die Technology Overview
4.4.2 Die Embedding Approaches
4.4.3 Materials Evolution for Embedded Die Technology
4.4.4 Component Integration Strategies
4.4.5 Key Applications and Use Cases
4.4.6 Technical Challenges and Solutions
4.4.7 Technology Roadmap (2025-2035)
4.4.8 Case Studies: Advanced Embedded Die Applications
4.5 EMERGING SUBSTRATE TECHNOLOGIES
4.5.1 Fan-Out Panel Level Packaging (FOPLP) Substrates
4.5.2 Silicon Interposer Technologies
4.5.3 Low-Temperature Co-fired Ceramic (LTCC) Substrates for Specialty Applications
4.5.4 Flexible and Stretchable Substrate Technologies
4.5.5 Additive Manufacturing for Substrate Fabrication
4.5.6 Co-Packaged Optics Substrates
4.5.7 3D Substrate Technologies
4.5.8 Bio-Degradable and Environmentally-Friendly Substrate Technologies
4.5.9 Technology Comparison and Positioning
4.5.10 Emerging Technology Roadmaps (2025-2035)

5 APPLICATION AND END-MARKET ANALYSIS
5.1 HIGH-PERFORMANCE COMPUTING AND AI ACCELERATOR APPLICATIONS
5.1.1 Substrate Requirements for AI and HPC Applications
5.1.2 Large Form Factor Substrates (>100mm x 100mm)
5.1.3 Chiplet Architecture Support
5.1.4 Case Studies: Advanced AI Accelerator Substrate Solutions
5.1.5 Market Forecasts for HPC/AI Substrates (2025-2035)
5.2 DATA CENTER AND NETWORKING APPLICATIONS
5.2.1 Substrate Requirements for Data Center Applications
5.2.2 Co-Packaged Optics (CPO) Substrates
5.2.3 High-Speed Substrate Design for 112G/224G SerDes
5.2.4 Case Studies: Data Center Substrate Solutions
5.2.5 Market Forecasts for Data Center Substrates (2025-2035)
5.3 MOBILE AND CONSUMER ELECTRONICS APPLICATIONS
5.3.1 Substrate Requirements for Mobile Devices
5.3.2 Wearable Electronics Substrate Solutions
5.3.3 Consumer Electronics Applications
5.3.4 Case Studies: Mobile and Consumer Substrate Solutions
5.3.5 Market Forecasts for Mobile and Consumer Substrates (2025-2035)
5.4 AUTOMOTIVE
5.4.1 Substrate Requirements for Automotive Applications
5.4.2 Reliability Requirements and Qualification Standards
5.4.3 Electric Vehicle-Specific Substrate Requirements
5.4.4 Case Studies: Automotive Substrate Solutions
5.4.5 Market Forecasts for Automotive Substrates (2025-2035)
5.5 INDUSTRIAL AND OTHER APPLICATIONS (Pages 381-400)
5.5.1 Industrial Control and Automation Substrates
5.5.2 Medical Electronics Applications
5.5.3 Aerospace and Defense Substrate Requirements
5.5.4 IoT and Edge Computing Devices
5.5.5 Energy Infrastructure Applications
5.5.6 Special Requirements for Harsh Environment Applications
5.5.7 Case Studies: Specialty Substrate Solutions
5.5.8 Market Forecasts for Industrial and Other Applications (2025-2035)

6 SUPPLY CHAIN ANALYSIS AND COMPETITIVE LANDSCAPE
6.1 Organic Substrate Manufacturers
6.2 Glass Substrate Manufacturers and Developers
6.3 Embedded Die Technology Providers
6.4 SLP Manufacturers
6.5 Material Suppliers
6.6 Equipment Suppliers
6.7 Raw Material Supply Chain
6.8 Equipment and Tool Supply Chain
6.9 Regional Manufacturing Capabilities
6.10 Supply Chain Risks and Mitigation Strategies

7 TECHNOLOGY ROADMAP AND FUTURE OUTLOOK
7.1 Unified Technology Roadmap (2025-2035)
7.2 Emerging Manufacturing Technologies
7.3 Material Innovation Outlook
7.4 Future Design Trends and Methodologies
7.5 Industry Convergence and Disruption Scenarios
7.6 Long-Term Market Outlook (2035 and Beyond)

8 SUSTAINABILITY AND ESG CONSIDERATIONS
8.1 Environmental Impact of Substrate Manufacturing
8.2 Carbon Footprint Analysis by Substrate Type
8.3 Water Usage in Advanced Substrate Production
8.4 Hazardous Material Management
8.5 Energy Efficiency Initiatives
8.6 Recycling and Circular Economy Approaches
8.7 Sustainable Material Development
8.8 ESG Reporting and Compliance
8.9 Sustainability Roadmap (2025-2035)

9 COMPANY PROFILES (116 company profiles)

For more information about this report visit https://www.researchandmarkets.com/r/kb37dq

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