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May 29, 2024 12:30 ET | Source: Custom Market Insights

[Latest] Global Lithography Equipment Market Size/Share Worth USD 49.6 Billion by 2033 at a 7.5% CAGR: Custom Market Insights (Analysis, Outlook, Leaders, Report, Trends, Forecast, Segmentation, Growth, Growth Rate, Value)

Austin, TX, USA, May 29, 2024 (GLOBE NEWSWIRE) -- Custom Market Insights has published a new research report titled “Lithography Equipment Market Size, Trends and Insights By Technology (Mask...
July 31, 2023 13:30 ET | Source: Custom Market Insights

[Latest] Global Advanced Chip Packaging Market Size/Share Worth USD 71.8 Billion by 2032 at a 8.2% CAGR: Custom Market Insights (Analysis, Outlook, Leaders, Report, Trends, Forecast, Segmentation, Growth, Growth Rate, Value)

Austin, TX, USA, July 31, 2023 (GLOBE NEWSWIRE) -- Custom Market Insights has published a new research report titled “Advanced Chip Packaging Market Size, Trends and Insights By Technology (2.5D...
July 28, 2014 16:00 ET | Source: STATS ChipPAC

STATS ChipPAC's Encapsulated Wafer Level Chip Scale Package (eWLCSP) Delivers Superior Quality Benefits

SINGAPORE 29 JULY 2014, UNITED STATES--(Marketwired - Jul 28, 2014) - STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company") (SGX-ST: STATSChP) (SGX: S24), a leading provider of advanced...
May 27, 2014 16:00 ET | Source: STATS ChipPAC

STATS ChipPAC Introduces Robust Encapsulated Wafer Level Packaging Technology

SINGAPORE--28 MAY 2014, UNITED STATES--(Marketwired - May 27, 2014) - STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company") (SGX-ST: STATSChP) (SGX: S24), a leading provider of advanced...
April 16, 2014 08:00 ET | Source: Deca Technologies

Deca Technologies Ships 100-Millionth Wafer-Level Packaged Component

TEMPE, AZ--(Marketwired - Apr 16, 2014) - Deca Technologies, an electronic interconnect solutions provider to the semiconductor industry, today announced that it has shipped its 100-millionth...
March 11, 2014 11:00 ET | Source: STATS ChipPAC

STATS ChipPAC Introduces Breakthrough Manufacturing Method for Wafer Level Packaging

SINGAPORE--11 MARCH 2014, UNITED STATES--(Marketwired - Mar 11, 2014) - STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company") (SGX-ST: STATSChP) (SGX: S24), a leading provider of advanced...
May 28, 2013 05:15 ET | Source: STATS ChipPAC

STATS ChipPAC Expands in Singapore With Grand Opening of New Building

SINGAPORE -- 28 MAY 2013, UNITED STATES--(Marketwired - May 28, 2013) - STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company") (SGX-ST: STATSChP) (SGX: S24), a leading provider of advanced...
January 05, 2012 04:00 ET | Source: STATS ChipPAC

STATS ChipPAC Expands Manufacturing Presence in Singapore With a New Factory

SINGAPORE--05/01/2012, UNITED STATES--(Marketwire - Jan 5, 2012) - STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company") (SGX-ST: STATSChP), a leading semiconductor test and advanced packaging...
November 16, 2011 23:00 ET | Source: STATS ChipPAC

STATS ChipPAC Completes Expansion of 300mm Wafer Bump and WLCSP Operation in Taiwan

SINGAPORE--11/17/2011, UNITED STATES--(Marketwire - Nov 16, 2011) - STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company") (SGX-ST: STATSChP), a leading semiconductor test and advanced packaging...