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May 27, 2014 16:00 ET | Source: STATS ChipPAC

STATS ChipPAC Introduces Robust Encapsulated Wafer Level Packaging Technology

SINGAPORE--28 MAY 2014, UNITED STATES--(Marketwired - May 27, 2014) - STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company") (SGX-ST: STATSChP) (SGX: S24), a leading provider of advanced...
April 28, 2014 05:30 ET | Source: STATS ChipPAC

STATS ChipPAC Conferred Singapore's Prestigious Distinguished Partner in Progress Award

SINGAPORE - 28 APRIL 2014--(Marketwired - Apr 28, 2014) - STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company") (SGX-ST: STATSChP) (SGX: S24), a leading provider of advanced semiconductor packaging...
March 11, 2014 11:00 ET | Source: STATS ChipPAC

STATS ChipPAC Introduces Breakthrough Manufacturing Method for Wafer Level Packaging

SINGAPORE--11 MARCH 2014, UNITED STATES--(Marketwired - Mar 11, 2014) - STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company") (SGX-ST: STATSChP) (SGX: S24), a leading provider of advanced...
August 19, 2013 17:00 ET | Source: STATS ChipPAC

STATS ChipPAC Delivers Industry Leading Ultra Thin Package-on-Package Solutions With eWLB Packaging

SINGAPORE -- 20 AUGUST 2013, UNITED STATES--(Marketwired - Aug 19, 2013) - STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company") (SGX-ST: STATSChP) (SGX: S24), a leading provider of...
August 12, 2013 17:00 ET | Source: STATS ChipPAC

STATS ChipPAC and Nanyang Technological University Collaborate on New Innovative Packaging Technologies

SINGAPORE -- 13 AUGUST 2013, UNITED STATES--(Marketwired - Aug 12, 2013) - STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company") (SGX-ST: STATSChP) (SGX: S24), a leading provider of advanced...
May 28, 2013 05:15 ET | Source: STATS ChipPAC

STATS ChipPAC Expands in Singapore With Grand Opening of New Building

SINGAPORE -- 28 MAY 2013, UNITED STATES--(Marketwired - May 28, 2013) - STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company") (SGX-ST: STATSChP) (SGX: S24), a leading provider of advanced...
March 06, 2012 08:30 ET | Source: STATS ChipPAC

STATS ChipPAC's Scalable 3D eWLB Solutions Deliver Performance, Height and Cost Advantages Over Substrate-Based Package-on-Package Technology

SINGAPORE--06/03/2012, UNITED STATES--(Marketwire - Mar 6, 2012) - STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company") (SGX-ST: STATSChP), a leading semiconductor test and advanced packaging...
January 05, 2012 04:00 ET | Source: STATS ChipPAC

STATS ChipPAC Expands Manufacturing Presence in Singapore With a New Factory

SINGAPORE--05/01/2012, UNITED STATES--(Marketwire - Jan 5, 2012) - STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company") (SGX-ST: STATSChP), a leading semiconductor test and advanced packaging...
November 16, 2011 23:00 ET | Source: STATS ChipPAC

STATS ChipPAC Completes Expansion of 300mm Wafer Bump and WLCSP Operation in Taiwan

SINGAPORE--11/17/2011, UNITED STATES--(Marketwire - Nov 16, 2011) - STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company") (SGX-ST: STATSChP), a leading semiconductor test and advanced packaging...
May 31, 2011 13:30 ET | Source: STATS ChipPAC

STATS ChipPAC's Fan-Out Wafer Technology Platform Delivers High Performance, Highly Integrated Solutions in a Wide Range of Package Configurations

SINGAPORE -- 6/1/2011, UNITED STATES--(Marketwire - May 31, 2011) - STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company") (SGX-ST: STATSChP), a leading semiconductor test and advanced packaging...

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