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SAINT-SULPICE, Switzerland, Jan. 24, 2023 (GLOBE NEWSWIRE) -- Kandou, an innovative leader in high-speed, energy-efficient chip-to-chip link solutions that improve the way the world connects and...
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LAUSANNE, Switzerland, Jan. 09, 2023 (GLOBE NEWSWIRE) -- Who: Kandou’s Dr. Amin Shokrollahi, Founder and CEO, and Jeff Winzeler, CFO What: Will present the Kandou vision and innovative...
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LAUSANNE, Switzerland, Nov. 17, 2020 (GLOBE NEWSWIRE) -- Kandou, an innovative leader in high-speed, energy-efficient, chip link solutions, today closed its Series C round of funding, resulting in...
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LAUSANNE, Switzerland, Sept. 10, 2019 (GLOBE NEWSWIRE) -- Kandou, a global leader in ultra-low power wired connectivity, has announced development is underway for the industry’s first USB-C®...