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January 23, 2018 08:00 ET | Source: aveni

aveni® S.A. Announces Breakthrough Electrical Yield Results for 12:1 TSVs

MASSY, France, Jan. 23, 2018 (GLOBE NEWSWIRE) -- aveni S.A., developer and manufacturer of market-disrupting wet deposition technologies and chemistries for 3D through silicon via (TSV) packaging...
July 08, 2013 08:00 ET | Source: Alchimer

Alchimer Signs Collaboration With CEA-Leti to Evaluate Metallization Processes for High Aspect Ratio TSV Applications

MASSY, FRANCE--(Marketwired - Jul 8, 2013) - Alchimer, S.A. today announced a collaboration with the French research institute CEA-Leti to evaluate and implement Alchimer's wet deposition...