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Virtual engineering and collaboration processes supported by web-based high-performance computing (HPC) environment, ExaCLOUD®SDF utilizes Exa® software for all of its thermal engineering...
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BURLINGTON, Mass., April 2, 2015 (GLOBE NEWSWIRE) -- Exa® Corporation (Nasdaq:EXA) announces its newest release, PowerFLOW 5.1, offering up to a 300% speed up for complex transient cabin comfort...
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ExaCLOUD provides cloud-based access to the full suite of Exa simulation products Scalable and secure high-performance simulation environment brings state-of-the-art engineering to all...
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BURLINGTON, Mass., March 21, 2014 (GLOBE NEWSWIRE) -- Exa® Corporation (Nasdaq:EXA), a global innovator of fluids simulation solutions for product engineering, stated that Cummins Inc. and...
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BURLINGTON, Mass. and YOKOHAMA, Japan, May 31, 2013 (GLOBE NEWSWIRE) -- Exa® Corporation (Nasdaq:EXA), a global innovator of fluids simulation solutions for product engineering, today announced...
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SINGAPORE--12 September 2012, UNITED STATES--(Marketwire - Sep 11, 2012) - STATS ChipPAC Ltd. ("STATS ChipPAC") (SGX-ST: STATSChP), a leading semiconductor test and advanced packaging service...