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December 09, 2013 08:00 ET | Source: Ziptronix

Ziptronix Teams With Tezzaron and Novati Technologies to Accelerate Development of 3D ICs

RESEARCH TRIANGLE PARK, NC--(Marketwired - Dec 9, 2013) - Ziptronix Inc., provider of patented, low-temperature direct bonding technology for 3D integration, today announced an agreement with...