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August 19, 2013 17:00 ET | Source: STATS ChipPAC

STATS ChipPAC Delivers Industry Leading Ultra Thin Package-on-Package Solutions With eWLB Packaging

SINGAPORE -- 20 AUGUST 2013, UNITED STATES--(Marketwired - Aug 19, 2013) - STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company") (SGX-ST: STATSChP) (SGX: S24), a leading provider of...
March 06, 2012 08:30 ET | Source: STATS ChipPAC

STATS ChipPAC's Scalable 3D eWLB Solutions Deliver Performance, Height and Cost Advantages Over Substrate-Based Package-on-Package Technology

SINGAPORE--06/03/2012, UNITED STATES--(Marketwire - Mar 6, 2012) - STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company") (SGX-ST: STATSChP), a leading semiconductor test and advanced packaging...