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November 17, 2020 11:00 ET | Source: Kandou Bus

Kandou Raises $92.3 Million in Series C Funding

LAUSANNE, Switzerland, Nov. 17, 2020 (GLOBE NEWSWIRE) -- Kandou, an innovative leader in high-speed, energy-efficient, chip link solutions, today closed its Series C round of funding, resulting in...
September 10, 2019 07:00 ET | Source: Kandou Bus

Kandou Announces Development of USB4™ Retimer

LAUSANNE, Switzerland, Sept. 10, 2019 (GLOBE NEWSWIRE) -- Kandou, a global leader in ultra-low power wired connectivity, has announced development is underway for the industry’s first USB-C®...
July 24, 2018 08:00 ET | Source: Kandou Bus

Kandou Bus Closes Series B Investment Round

LAUSANNE, Switzerland, July 24, 2018 (GLOBE NEWSWIRE) -- Kandou Bus, S.A., a world leader in development of SerDes IP and chip solutions, has completed its Series B investment round with a $15M...
June 25, 2018 16:38 ET | Source: Kandou Bus

Kandou’s Dr. Amin Shokrollahi to Speak about Chord™ Signaling at Design Automation Conference (DAC)

LAUSANNE, Switzerland, June 25, 2018 (GLOBE NEWSWIRE) -- Kandou Bus announced today that Dr. Amin Shokrollahi, Founder and CEO of Kandou, will speak at the 2018 Design Automation Conference (DAC) as...
May 23, 2018 07:00 ET | Source: Kandou Bus

Kandou Announces Availability of Glasswing™ USR SerDes IP

LAUSANNE, Switzerland, May 23, 2018 (GLOBE NEWSWIRE) -- Kandou Bus S.A., the global pioneer in multi-wire SerDes technology, today announced the introduction of the Glasswing™ USR SerDes, enabling...
January 13, 2016 07:00 ET | Source: Kandou Bus

Kandou to Present Alternative for 56G and Beyond Backplane Interconnect at DesignCon 2016

LAUSANNE, SWITZERLAND--(Marketwired - January 13, 2016) - Kandou Bus will present a paper at DesignCon 2016 that will compare the sensitivity of PAM4 and Ensemble NRZ ("ENRZ") to...