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Farmington, April 28, 2023 (GLOBE NEWSWIRE) -- The Global Underfill Market Was Valued At USD 357.8 Million In 2022 And Is Expected To Expand USD 846.9 Million By 2030 at a CAGR Of 8.99% From 2022...
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DUBAI, United Arab Emirates, Jan. 18, 2022 (GLOBE NEWSWIRE) -- The global industrial electronics packaging market currently enjoys a valuation of US$ 1.9 Bn, and is predicted to expand at a CAGR...
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FOUNTAIN INN, S.C., May 5, 2016 (GLOBE NEWSWIRE) -- AVX Corporation, a leading manufacturer of passive components and interconnect solutions, has released two new series of wire-to-wire (WTW)...
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GREENVILLE, S.C., May 12, 2015 (GLOBE NEWSWIRE) -- AVX Corporation, a leading manufacturer of passive components and interconnect solutions, has released a new 2mm vertical poke-home wire-to-board...