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May 31, 2011 08:00 ET | Source: JCM Global

JCM Global and Techfirm Inc. Sign Memorandum of Understanding to Bring Pay-by-Mobile Phone Technology to Bill Validators

LAS VEGAS, NV and TOKYO--(Marketwire - May 31, 2011) - Technology development leaders JCM Global (TSE: 6418) (OSE: 6418) and Techfirm Inc. (JASDAQ: 3625) have signed a memorandum of understanding...