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May 03, 2011 16:00 ET | Source: STATS ChipPAC

STATS ChipPAC Ships Over 300 Million Copper Wirebond Units and Expands Fine Pitch Solutions

SINGAPORE--5/4/2011, UNITED STATES--(Marketwire - May 3, 2011) - STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company") (SGX-ST: STATSChP), a leading semiconductor test and advanced packaging service...