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Features a panel on global chip supply challenges Experts review 8-Digit BIN migration considerations Workshop provides insight on mobile driver’s license (mDL) early adoption, pilot programs and...
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PRINCETON JUNCTION, N.J., June 19, 2019 (GLOBE NEWSWIRE) -- Stakeholders from across the payments industry will gather this July at the U.S. Payments Forum All-Member Meeting to continue their...
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MOUNTAIN VIEW, Calif., April 17, 2019 (GLOBE NEWSWIRE) -- https://www.w3.org/ — The FIDO Alliance, EMVCo, and the World Wide Web Consortium (W3C) announced today the creation of a new Interest Group...
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PRINCETON JUNCTION, N.J., June 27, 2018 (GLOBE NEWSWIRE) -- The U.S. Payments Forum announced today the agenda for its July Member Meeting in Burlingame, California. Payment industry leaders will...
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AMSTERDAM, the Netherlands, June 04, 2018 (GLOBE NEWSWIRE) -- (Money 20/20 Europe) EMVCo, the global technical body that manages the EMV® Specifications, and the FIDO Alliance, an industry...
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EINDHOVEN, The Netherlands and RIO DE JANEIRO, Brazil, Aug. 18, 2016 (GLOBE NEWSWIRE) -- NXP Semiconductors N.V. (NASDAQ:NXPI) in partnership with RioCard, Brazil’s smart card system for...
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SAN JOSE, Calif., Sept. 8, 2015 (GLOBE NEWSWIRE) -- As the U.S. payments landscape evolves with the migration to EMV chip technology, popularity of Apple Pay and the anticipated release of Samsung...
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SAN FRANCISCO, July 20, 2015 (GLOBE NEWSWIRE) -- FIME's EMV® RF test tool, which incorporates Keysight Technologies' Contactless Test System, is the first to achieve EMVCo qualification to...