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September 15, 2023 09:48 ET | Source: Persistence Market Research

Booming Demand for Electronic Board Level Underfill and Encapsulation Materials Set to Propel Market to US$ 526.3 million by 2033 | Persistence Market Research

New York, Sept. 15, 2023 (GLOBE NEWSWIRE) -- Electronic board-level underfill and encapsulating material sales were projected to reach a value of around US$ 310.7 million by the end of 2022. The...