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January 07, 2025 21:00 ET | Source: Micron Technology, Inc.

Micron Breaks Ground on New HBM Advanced Packaging Facility in Singapore

SINGAPORE, Jan. 08, 2025 (GLOBE NEWSWIRE) -- Micron Technology, Inc. (Nasdaq: MU) broke ground today on a new High-Bandwidth Memory (HBM) advanced packaging facility adjacent to the company’s...