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April 30, 2018 08:00 ET | Source: Microchip Technology Inc

SST and UMC Announce Qualification of Embedded SuperFlash® Technology on 40 nm CMOS Process

CHANDLER, Ariz., April 30, 2018 (GLOBE NEWSWIRE) -- The amount of data processed in Internet of Things (IoT) applications continues to increase, making low power and high density paramount to system...
October 29, 2013 09:00 ET | Source: Sidense

Sidense Advanced Process Node 1T-OTP to Be Used in Sigma Designs DTV Products

OTTAWA, ON--(Marketwired - Oct 29, 2013) - Sidense Corp., a leading developer of Logic Non-Volatile Memory (LNVM) OTP IP cores, today announced that Sigma Designs®, a leading provider of...
July 31, 2013 09:00 ET | Source: Sidense

Sidense Announces SHF 1T-OTP Non-Volatile Memory IP for Advanced Process Chip Designs

OTTAWA--(Marketwired - Jul 31, 2013) - Sidense Corp., a leading developer of Logic Non-Volatile Memory (LNVM) OTP IP cores, today announced its SHF (Sidense Hiper Fuse) one-time programmable (OTP)...
November 16, 2011 23:00 ET | Source: STATS ChipPAC

STATS ChipPAC Completes Expansion of 300mm Wafer Bump and WLCSP Operation in Taiwan

SINGAPORE--11/17/2011, UNITED STATES--(Marketwire - Nov 16, 2011) - STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company") (SGX-ST: STATSChP), a leading semiconductor test and advanced packaging...