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November 28, 2023 05:30 ET | Source: Research Nester

Silicon on Insulator Market revenue to hit USD 10 Billion by 2036, says Research Nester

New York, Nov. 28, 2023 (GLOBE NEWSWIRE) -- The global silicon on insulator (SOI) market size is predicted to grow at a CAGR of over ~14.6% from 2024 to 2036. The market is projected to garner a...
March 11, 2014 11:00 ET | Source: STATS ChipPAC

STATS ChipPAC Introduces Breakthrough Manufacturing Method for Wafer Level Packaging

SINGAPORE--11 MARCH 2014, UNITED STATES--(Marketwired - Mar 11, 2014) - STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company") (SGX-ST: STATSChP) (SGX: S24), a leading provider of advanced...
July 08, 2013 08:00 ET | Source: Alchimer

Alchimer Signs Collaboration With CEA-Leti to Evaluate Metallization Processes for High Aspect Ratio TSV Applications

MASSY, FRANCE--(Marketwired - Jul 8, 2013) - Alchimer, S.A. today announced a collaboration with the French research institute CEA-Leti to evaluate and implement Alchimer's wet deposition...
June 11, 2013 06:00 ET | Source: Alchimer

Alchimer to Collaborate With Imec on Advanced Nano-Interconnect Technologies at Sub-22nm Manufacturing

MASSY, FRANCE--(Marketwired - Jun 11, 2013) - Alchimer, S.A., a leading provider of wet deposition technologies for dual damascene, through-silicon vias (TSVs), MEMS and solar, today announced a...
November 16, 2011 23:00 ET | Source: STATS ChipPAC

STATS ChipPAC Completes Expansion of 300mm Wafer Bump and WLCSP Operation in Taiwan

SINGAPORE--11/17/2011, UNITED STATES--(Marketwire - Nov 16, 2011) - STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company") (SGX-ST: STATSChP), a leading semiconductor test and advanced packaging...
April 18, 2011 16:00 ET | Source: STATS ChipPAC

STATS ChipPAC Expands Through Silicon Via Capabilities With Mid-End Processing

SINGAPORE - 4/19/2011, UNITED STATES--(Marketwire - Apr 18, 2011) - STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company") (SGX-ST: STATSChP), a leading semiconductor test and advanced packaging...