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Austin, TX, USA, July 31, 2023 (GLOBE NEWSWIRE) -- Custom Market Insights has published a new research report titled “Advanced Chip Packaging Market Size, Trends and Insights By Technology (2.5D...
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SAN JOSE, Calif., Nov. 20, 2018 (GLOBE NEWSWIRE) -- eSilicon, a leading provider of FinFET-class ASICs, market-specific IP platforms and advanced 2.5D packaging solutions, will present its two new...
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Demos and private meetings available at SC18 SAN JOSE, Calif., Oct. 25, 2018 (GLOBE NEWSWIRE) -- eSilicon, a leading provider of FinFET-class ASICs, market-specific IP platforms and advanced 2.5D...
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SAN JOSE, Calif., Oct. 24, 2018 (GLOBE NEWSWIRE) -- eSilicon, a leading provider of FinFET-class ASICs, market-specific IP platforms and advanced 2.5D packaging solutions, will deliver two...
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10 percent discount available: use code ESILICON10 at registration SAN JOSE, Calif., Sept. 06, 2018 (GLOBE NEWSWIRE) -- eSilicon, an independent provider of FinFET-class ASICs,...
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SAN JOSE, Calif., Aug. 14, 2018 (GLOBE NEWSWIRE) -- eSilicon, an independent provider of FinFET-class ASICs, market-specific IP platforms and advanced 2.5D packaging solutions, announced today the...
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7nm networking platform delivers unprecedented performance and configurability for data center ASICs
SAN JOSE, Calif., June 26, 2018 (GLOBE NEWSWIRE) -- eSilicon, an independent provider of FinFET-class ASICs, market-specific IP platforms and advanced 2.5D packaging solutions, announced today the...
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SANTA CLARA, Calif., June 05, 2018 (GLOBE NEWSWIRE) -- eSilicon, an independent provider of FinFET-class ASICs, custom IP, and advanced 2.5D packaging solutions, announced today at the Machine...
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Chip employs TSMC CoWoS® technology to integrate SoC and HBM2 SAN JOSE, Calif., May 01, 2018 (GLOBE NEWSWIRE) -- eSilicon, an independent provider of FinFET-class ASICs, custom IP, and advanced...
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April 03, 2018 08:30 ET | Source: eSilicon; Samsung Electronics Co., Ltd.; Amkor Technology, Inc.; Northwest Logic
SAN JOSE, Calif., April 03, 2018 (GLOBE NEWSWIRE) -- Deep learning applications require extreme performance, low power and high efficiency to effectively process the massive amounts of data used in...