Latest News and Press Releases

SUNNYVALE, CA--(Marketwire - March 10, 2010) -  ALLVIA, the first through-silicon via (TSV) foundry, in conjunction with Semiconductor International magazine, will broadcast a webcast on how to...

SUNNYVALE, CA--(Marketwire - February 23, 2010) - ALLVIA, the first through-silicon via (TSV) foundry, has integrated embedded capacitors on Silicon Interposers, a key interface between a silicon...

HILLSBORO, OR--(Marketwire - January 18, 2010) - In response to growing business activity in Taiwan and in South East Asia, NexPlanar has established a representative office in Taipei. "We have been...

SUNNYVALE, CA--(Marketwire - January 13, 2010) - ALLVIA, the first through-silicon via (TSV) foundry, has completed the integration of a silicon interposer between a semiconductor die and an organic...

SUNNYVALE, CA--(Marketwire - December 1, 2009) - ALLVIA, the first through-silicon via (TSV) foundry, will present its latest analysis on via processing and reliability during the 3D Architectures...

ATLANTA, GA--(Marketwire - November 19, 2009) - ClassOne Equipment, Inc., a leading supplier of refurbished equipment for the semiconductor and nanotechnology markets, has recently purchased all of...

ATLANTA, GA--(Marketwire - November 10, 2009) - ClassOne Equipment, Inc., a leading supplier of refurbished equipment for the semiconductor and nanotechnology markets, is making an aggressive push...

YOKNEAM, ISRAEL--(Marketwire - November 4, 2009) - A major Japanese semiconductor device manufacturer has purchased and qualified Sela's new Xact sample preparation system. The system has been fully...

HILLSBORO, OR--(Marketwire - October 27, 2009) - NexPlanar, the semiconductor CMP pad technology company, has introduced the Element™ family of CMP pads designed to deliver high removal rates,...

SUNNYVALE, CA--(Marketwire - October 22, 2009) - ALLVIA, the first through-silicon via (TSV) foundry, has purchased a manufacturing facility in Hillsboro, Oregon, for high volume production of their...