Latest News and Press Releases

LAUSANNE, SWITZERLAND --(Marketwired - March 14, 2016) - Kandou Bus announced today that David Stauffer of Kandou will speak at the OFC Market Watch session entitled "OIF CEI 56G: Signal...

LAUSANNE, SWITZERLAND--(Marketwired - March 07, 2016) - Kandou Bus announced today that David Stauffer of Kandou will speak at the OIF "100G Serial Electrical Links and Beyond" workshop. Dr....

SAN FRANCISCO, CA--(Marketwired - January 27, 2016) - Kandou Bus has announced that it will present two papers and demonstrate its Chord Signaling™ link technology at the 2016 International...

LAUSANNE, SWITZERLAND--(Marketwired - January 14, 2016) - Kandou Bus will present a paper at DesignCon 2016 that will propose a method for increasing the useful channel spectrum in a...

LAUSANNE, SWITZERLAND--(Marketwired - January 13, 2016) - Kandou Bus will present a paper at DesignCon 2016 that will compare the sensitivity of PAM4 and Ensemble NRZ ("ENRZ") to...

LAUSANNE, SWITZERLAND--(Marketwired - December 02, 2015) - Kandou Bus announced today that their Glasswing physical interface SerDes block, code named GW28-125-USR, has been fully tested and...

SAN FRANCISCO, CA--(Marketwired - Mar 2, 2015) -  Kandou Bus received the Jan Van Vessem Award for Outstanding European Paper last week at the International Solid-State Circuits...

LAUSANNE, SWITZERLAND--(Marketwired - Nov 3, 2014) - Kandou Bus has announced the Glasswing™ family of chip interconnects targeted for in-package chip-to-chip links. Kandou introduced...

LAUSANNE, SWITZERLAND--(Marketwired - Mar 11, 2014) - Brian Holden, V.P. of Product Management at Kandou Bus, will participate in a panel discussion at OFC 2014 entitled "56 Gb/s serial: Why, What,...

SAN FRANCISCO, CA--(Marketwired - Feb 10, 2014) - Kandou Bus has announced that the first implementation of its breakthrough high-performance, low-power link technology will be introduced at the...