Latest News and Press Releases

LAUSANNE, Switzerland, May 12, 2020 (GLOBE NEWSWIRE) -- Kandou, an innovative leader in high-speed, energy-efficient, chip link solutions, confirmed today that Coherent Logix will implement its...

LAUSANNE, Switzerland, April 15, 2020 (GLOBE NEWSWIRE) -- Kandou, an innovative leader in high-speed, energy-efficient, chip link solutions, was named one of 50 European companies with the most...

LAUSANNE, SWITZERLAND, Feb. 12, 2020 (GLOBE NEWSWIRE) -- Dr. Amin Shokrollahi, Founder and Chief Executive Officer of Kandou, will present “Future Signaling and Coding: Channel Limitations and...

LAUSANNE, Switzerland, Jan. 28, 2020 (GLOBE NEWSWIRE) -- Kandou, an innovative leader in high-speed, energy efficient, chip link solutions, will demonstrate its ultra-short reach (USR) SerDes...

LAUSANNE, Switzerland, Dec. 12, 2019 (GLOBE NEWSWIRE) -- Kandou, an innovative leader in high-speed, energy efficient, chip-to-chip link solutions, will demonstrate a working prototype of the...

LAUSANNE, Switzerland and CENNTENNIAL, Colo., Oct. 30, 2019 (GLOBE NEWSWIRE) -- Kandou Bus announced today that their Glasswing™ chip-to-chip link technology has been licensed by SEAKR® Engineering...

LAUSANNE, Schweiz, Sept. 24, 2019 (GLOBE NEWSWIRE) -- Kandou, ein weltweit führendes Unternehmen für IP-Konnektivität und Chiplösungen, hat heute eine zusätzliche Investition in der Höhe von 56...

LAUSANNE, Switzerland, Sept. 23, 2019 (GLOBE NEWSWIRE) -- Kandou, a global leader in connectivity IP and chip solutions, today announced an additional investment of $56 million, through a consortium...

LAUSANNE, Switzerland, Sept. 10, 2019 (GLOBE NEWSWIRE) -- Kandou, a global leader in ultra-low power wired connectivity, has announced development is underway for the industry’s first USB-C®...

LAUSANNE, Switzerland, Dec. 11, 2018 (GLOBE NEWSWIRE) -- Kandou Bus S.A., the global pioneer in multi-wire SerDes technology, today announced that the United States Patent and Trademark Office has...