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November 05, 2007 13:34 ET | Source: Inapac

Inapac Teams With e-MDT for Sales and Application Support in Korea

SAN JOSE, CA--(Marketwire - November 5, 2007) - Inapac Technology, Inc., a leading provider of DRAM solutions optimized for system-in-package (SiP) and multi-chip-package (MCP) devices, today...
October 16, 2007 13:24 ET | Source: Inapac

Inapac Announces New 32Mb Stacked DRAM Design

SAN JOSE, CA--(Marketwire - October 16, 2007) - Inapac Technology, Inc., a leading provider of DRAM solutions optimized for system-in-package (SiP) and multi-chip-package (MCP) devices, today...
June 04, 2007 09:00 ET | Source: Mechdyne Corporation

Mechdyne Enhances Power of PTC(R) Pro/ENGINEER(R) for 3D Design Review

MARSHALLTOWN, IA--(Marketwire - June 4, 2007) - Mechdyne Corporation, a leading provider of immersive visualization systems, software and services, today announced that its Conduit Software module...
May 30, 2007 13:54 ET | Source: Inapac

Inapac Technology and ProMOS to Collaborate on 256Mb Mobile DDR DRAM for System-in-Package/Multi-Chip Package Applications

SAN JOSE, CA--(Marketwire - May 30, 2007) - Inapac Technology, Inc. today announced that it has entered into a development agreement with ProMOS Technologies, a leading manufacturer of DRAM products,...
April 25, 2007 09:00 ET | Source: Inapac

Inapac Technology Releases New 16Mb DRAM Design for Mobile Applications That Reduces SiP/MCP Cost

SAN JOSE, CA -- (MARKET WIRE) -- April 25, 2007 -- Inapac Technology, Inc., the leading provider of DRAM solutions for system-in-package (SiP) and multi-chip-package (MCP) devices, today announced the...
April 10, 2007 09:00 ET | Source: Mechdyne Corporation

Mechdyne Set to Unveil World's Highest Resolution Immersive Virtual Reality Environment

MARSHALLTOWN, IA -- (MARKET WIRE) -- April 10, 2007 -- Mechdyne Corporation and Iowa State University are making final preparations for the grand opening of the most impressive virtual reality...
March 12, 2007 09:00 ET | Source: Mechdyne Corporation

Mechdyne Enables Immersive Virtual Reality Capabilities in Autodesk Maya and 3ds Max

MARSHALLTOWN, IA -- (MARKET WIRE) -- March 12, 2007 -- Mechdyne Corporation today announced that its VRCO software division has expanded the compatibility of its immersive visualization solution to...
March 12, 2007 09:00 ET | Source: Mechdyne Corporation

Mechdyne Introduces Transportable Immersive Display System for Trade Events, Command/Control and Traveling Demonstrations

MARSHALLTOWN, IA -- (MARKET WIRE) -- March 12, 2007 -- Mechdyne Corporation announced today the general availability of the Fakespace Mobile FLEX™, a transportable, immersive display system that...
March 05, 2007 12:55 ET | Source: Inapac

Inapac Technology Products Selected by Vimicro for Mobile Multimedia Processors

SAN JOSE, CA -- (MARKET WIRE) -- March 5, 2007 -- Inapac Technology, Inc. today announced that Vimicro Corporation (NASDAQ: VIMC), a leading fabless semiconductor company in China, will begin using...
January 24, 2007 10:00 ET | Source: Fakespace Systems

Mechdyne Announces Visualization Software Extension for Immersive 3D Viewing of Google Earth(TM) Pro

MARSHALLTOWN, IA -- (MARKET WIRE) -- January 24, 2007 -- Mechdyne Corporation today announced that its VRCO software division released Conduit™ for Google Earth™ Pro 4.0, a visualization...