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December 16, 2015 08:45 ET | Source: Electro Scientific Industries, Inc.

ESI Announces Large Semiconductor Manufacturer to Take Delivery of Latest Integrated Circuit Packaging Solution

CornerStone™ ICP will facilitate the customer’s ongoing innovation in high-volume IC manufacturing and enable them to meet size, cost and performance goals PORTLAND, Ore., Dec. 16, 2015 ...
December 04, 2015 08:45 ET | Source: Electro Scientific Industries, Inc.

ESI Unveils Newest Addition to Its PCB Via Drilling Product Portfolio

New nViantTM CO2-Laser-Based HDI Processing System Delivers the Precision, Accuracy and Throughput Required for High Volume Manufacturing of PCB’sPORTLAND, Ore., Dec. 04, 2015 (GLOBE NEWSWIRE) --...
November 24, 2015 16:05 ET | Source: Electro Scientific Industries, Inc.

ESI Announces Participation in 2015 Midtown CAP Investor Summit

PORTLAND, Ore., Nov. 24, 2015 (GLOBE NEWSWIRE) -- Electro Scientific Industries, Inc. (NASDAQ:ESIO), an innovator in laser-based manufacturing solutions for the microtechnology industry, today...